ソルダーコート株式会社
High reliability Lead-free post flux. / SP-007
Excellent wettability make a good through-hole and significantly reduce the Solder-bridge of the IC.
Basic specification
| Conventional | SP-007 | Note | |
|---|---|---|---|
| Exterior and color | Liquid / Pale yellow transparency | Liquid / Pale yellow transparency | |
| Specific gravity | 0.810±0.010 | 0.820±0.010 | |
| Solid content | 15±2% | 15±2% | |
| Chloric content | 0.06±0.02% | 0.06±0.02% | JIS Z3197 |
| Spreading factor | 78±3% | 80±3% | JIS Z3197 (Used solder material is Sn-3.0Ag-0.5Cu) |
| Insulation resistance | More than1×1011Ω | More than1×1011Ω | JIS Z3197 |
| Residue corrosiveness | No corrosiveness | No corrosiveness | JIS Z3197 |
Comparison in Solder-bridge of IC
