ソルダーコート株式会社

High reliability Lead-free post flux. / SP-007

Excellent wettability make a good through-hole and significantly reduce the Solder-bridge of the IC.


Basic specification

Conventional SP-007 Note
Exterior and color Liquid / Pale yellow transparency Liquid / Pale yellow transparency
Specific gravity 0.810±0.010 0.820±0.010
Solid content 15±2% 15±2%
Chloric content 0.06±0.02% 0.06±0.02% JIS Z3197
Spreading factor 78±3% 80±3% JIS Z3197
(Used solder material is Sn-3.0Ag-0.5Cu)
Insulation resistance More than1×1011Ω More than1×1011Ω JIS Z3197
Residue corrosiveness No corrosiveness No corrosiveness JIS Z3197

Comparison in Solder-bridge of IC



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