SOLDER COAT CO.,LTD.
Decreased void type / Lead-free solder paste DP LF 219
Decreases occurrence of voids, even with high-temperature preheating. Shows good cleaning performance with semi-aqueous cleaning solvent.
| Viscosity(Pa·s) | 180-220 |
|---|---|
| Thixotropic Index | 0.55-0.65 |
| Halogen content(%) | <0.05 |
| Insulation resistance(Ω) | >1.0*109 |
| Copper corrosion test | Pass |
Comparison of void occurrence
Radiograph
