SOLDER COAT CO.,LTD.
Halogen-free / Lead-free solder paste XFP LF 219
A solder paste that realizes outstanding solderability while also reducing flux splash to the lowest possible amount.
| Viscosity(Pa·s) | 180-220 |
|---|---|
| Thixotropic Index | 0.55-0.65 |
| Halogen content(%) | Lower limit ofdetection*1 |
| Insulation resistance(Ω) | >1.0*108 *2 |
| Copper corrosion test | Pass |
*1 Combustion - Ion Chromatography
*2 Uses a circuit board that has been cleaned with water.
Cleanability
Pattern: QFP / 0.05mm pitch
Ultrasonic washing for 30 seconds in warm water at 40°
