A solder paste featuring improved viscosity and corrosiveness at a low cost.
| Viscosity(Pa·s) | 180-220 |
|---|---|
| Thixotropic Index | 0.55-0.65 |
| Halogen content(%) | <0.05 |
| Insulation resistance(Ω) | >1.0*109 |
| Copper corrosion test | Pass |
Atmosphere: Air, Peak temp.: 250°