Products Guide
BGA Solder Ball
- Highly accurate sphere and low cost are achieved by a newly developed metal jet method.
Addition of micro-additives increased cycle resistance and bonding ability.
| Sphere Diameter(mm) |
Tolerance(mm) |
| 0.10～0.15 |
±0.005 |
| 0.20～0.60 |
±0.010 |
| 0.65～0.80 |
±0.015 |
Heat-cycle resistance test
