SOLDER COAT CO.,LTD.

1.Lead-free solder design

• Stabilization of solder temperature is realized by large capacity of the pipe heater and enlarged size of solder bath.
• Lead-free SUS316 is used for the material of solder bath to prevent corrosion of the solder bath.
• Increased air heater capacity stabilizes the set air temperature.

2.Highly reliable HS-651 structure for the driving section

• A structure similar to HS-651 is adopted as the driving section to ensure realibility.

3.Highly efficient & energy saving vertical type leveler

• Vertical type leveler is applied in order to save space and improve speed

1.Touch panel system

• All functions are centrally controlled.
• Pipe heater control allows minute control of solder temperature.
• Data are recorded and stored.
• Past data can be called up for reapplication.
• Data can be transferred to PC for accumulation and editing.

2.Lead-free exclusive design

• Increased solder pipe heater capacity stabilizes solder temperature (15kw→17kw)
• Increased solder bath capacity stabilizes solder temperature (15% larger than the conventional one.)
• Material of solder bath is changed to SUS316 as an anti-corrosion measure, preventing the corrosion of the bath by lead-free solder.
• Minute control of solder temperature stabilizes the set solder temperature.

3.Reliable driving section built upon excellent performance

• HS-601-D structure is adopted as the driving section to increase reliability.
• Adoption of this compatible structure enables stable supply of parts.